Advanced Semiconductor Manufacturing Technology (ASML) in Berlin lacks chips but boasts cutting-edge technology for their production
In the heart of Berlin, a new high-tech manufacturing facility is making waves in the global chip industry. The building, known as BER08, located on the ASML campus in Berlin-Britz, is not just another addition to the city's skyline, but a game-changer for the future of semiconductor production.
BER08 is a state-of-the-art manufacturing system for the global chip industry. It is unique in its ability to combine all production stages under one roof, resulting in shorter distances, less handling, overall responsibility, faster production, more efficient production, and higher quality.
The innovation cycle is spinning faster, and competition wants it that way. One of the key technologies that set BER08 apart is EUV lithography, available exclusively at ASML. This technology allows for microchip production with light at a wavelength of 13.5 nm, almost in the X-ray range.
TSMC and Intel, two of the world's largest semiconductor manufacturers, are among ASML's major customers. The BER08 building is not only used for the production of new systems but also for the manufacturing of replacement parts, especially when it becomes possible to further increase the yield in chip production with the help of ASML's own systems.
The precision of the wafer tables used in the lithography system and further processing steps in the BER08 building is in the nanometer range. The surfaces of these tables are coated with diamond for a longer lifespan in chip factories. The BER08 building is sensitive to vibrations, so it is located in a low-lying area to minimize external interference.
The deep basement of the BER08 building houses special measuring technology and specific processing technologies, including ion beam techniques, to ensure extreme precision. Around 200 people are working in three shifts to complete the production process, including many academics such as production and quality engineers.
The production of wafer clamps requires over 250 production steps, which can take over six months in total. The EXE platform, the latest generation in EUV lithography, is set to support high-volume chip manufacturing in 2025 and 2026. This platform offers higher contrast and a resolution of just 8 nm, enabling geometric chip scaling into the next decade, including future advanced nodes starting with the 2-nm logic node.
Construction work is underway on building BER01, which will offer 20,000 square meters of space and be ready for occupancy in the second quarter of 2028. Both EUV and DUV systems are likely to be used in parallel in the coming years.
ASML is proud of its latest EUV lithography systems, which enable mass production of the most advanced microchips. The customers of ASML, the world's largest manufacturer of chip production equipment, include major chip manufacturers such as Taiwan Semiconductor Manufacturing Company (TSMC) and Intel. These companies rely on ASML's exclusive EUV lithography systems essential for producing advanced semiconductor chips.
Read also:
- Exploring Harry Potter's Lineage: Decoding the Enigma of His Half-Blood Ancestry
- Elon Musk Acquires 26,400 Megawatt Gas Turbines for Powering His AI Project, Overlooks Necessary Permits for Operation!
- U Power's strategic collaborator UNEX EV has inked a Letter of Intent with Didi Mobility to deploy UOTTA(TM) battery-swapping electric vehicles in Mexico.
- Commercial-grade hydrogen enhancement systems manufacturing initiated by H2i Technology
%20in%20Berlin%20lacks%20chips%20but%20boasts%20cutting-edge%20technology%20for%20their%20production){kind=link}